NIJ IV Silicon carbide ballistic armour plate pictures & photos

NIJ IV Silicon carbide ballistic armour plate

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Price

Min. Order Reference FOB Price

30 Pieces US$30.00-100.00 / Piece

Sepcifications

Type Ceramic Plates
Transport Package Wooden case with foam
Specification SSIC/SIC/Silicon Carbide
Trademark BD
Origin Weifang, China
Usage Defense
Using Field Land
Thickness 4mm~20mm
Density 3.05g/cm3
Hardness >110HS
Porosity Rate <0.3%
Compressive >2200MPa
Fractural Strength >350MPa
Coefficient of expansion 4.0 10/C
Content of Sic 99%
Thermal conductivity 0.30Cal/cm.s. C
Elastic Modulus >400GPa
Temperature 1300C

Product Description

NIJ IV Silicon carbide ballistic armour plate * Ballistic Material for the Plates: i) Alumina(AL2O3) Ceramic Tiles &Dyneema UHMW-PE Backing (III-IV) ii) Silicon Carbide( SIC) Ceramic Tiles &Dyneema UHMW-PE Backing (III-IV) iii) 100% Pure Dyneema UHMW-PE( III / III+/ III++) * ...

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WEIFANG BETTER CERAMICS CO., LTD.

Gold Member Since 2019

Audited Supplier

Business Type Manufacturer/Factory
Main Products SiSiC Products
Year of Establishment 2014-04-29
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month
OEM/ODM Availability Yes

military Comparison

	NIJ IV Silicon carbide ballistic armour plate Contact Now	Quick View Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate Contact Now	Quick View Coefficient of Thermal Expansion Low Customized Aluminium Nitride Ceramic Plate Contact Now	Quick View Wholesale Aluminum Nitride Thermal Conductive Plate Aln Electrical Insulation Ceramic Sheet Substrate Contact Now	Quick View Aln Aluminum Nitride Ceramic Substrate for Power Electronic Device Contact Now

Transaction Info
	NIJ IV Silicon carbide ballistic armour plate Contact Now	Quick View Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate Contact Now	Quick View Coefficient of Thermal Expansion Low Customized Aluminium Nitride Ceramic Plate Contact Now	Quick View Wholesale Aluminum Nitride Thermal Conductive Plate Aln Electrical Insulation Ceramic Sheet Substrate Contact Now	Quick View Aln Aluminum Nitride Ceramic Substrate for Power Electronic Device Contact Now
Price	US $ 30.00-100.00/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece	US $ 3.68-26.47/ Piece
Min Order	30 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal	L/C, T/T, D/P, Paypal
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Others	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia	Southeast Asia, Eastern Asia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Type: Ceramic Plates; Usage: Defense; Using Field: Land; Thickness: 4mm~20mm; Density: 3.05g/cm3; Hardness: >110HS; Porosity Rate: <0.3%; Compressive: >2200MPa; Fractural Strength: >350MPa; Coefficient of expansion: 4.0 10/C; Content of Sic: 99%; Thermal conductivity: 0.30Cal/cm.s. C; Elastic Modulus: >400GPa; Temperature: 1300C;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plate, Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;	Application: Industrial Ceramic, Electronic Ceramic; Type: Ceramic Plates; Lead Time: 30 Days; Density: 3.33G/Cm^3; Thermal Conductivity: >180/25ºCw/(Mk); Dielectric Constant: 8.8/1MHz; Material: Aluminium Nitride;
Supplier Name	WEIFANG BETTER CERAMICS CO., LTD.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.	Binzhou Aonuo New Material Technology Co., Ltd.
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