Max186ccap+ China Electronics Component

US$24.00-24.50 / Piece

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What is Chipsun Promotion Sale Max186ccap+ China Electronics Component

Name: Chipsun Promotion Sale Max186ccap+ China Electronics Component
Uploaded: 2023-04-23T16:18:32+08:00
Description: Product Description Type Description Part Number MAX186CCAP+ Manufacturer Analog Devices Inc./Maxim Integrated Description IC DAS/ADC 12BIT 133K 20SSOP Detailed Description Data Acquisition Syste

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Price

Purchase Qty. Reference FOB Price

500-999 Pieces US$24.50

1,000+ Pieces US$24.00

Sepcifications

shape -
Conductive Type -
Integration -
Technics -
Transport Package 20-Ssop
Specification Standard Edition
Trademark Analog Devices Inc.
Origin Original
Part Number Standard Edition
Description Standard Edition
Detailed Description Data Acquisition System (Das), ADC 12 B 133K Micro
Product Status Active

Product Description

Product Description Type Description Part Number MAX186CCAP+ Manufacturer Analog Devices Inc./Maxim Integrated Description IC DAS/ADC 12BIT 133K 20SSOP Detailed Description Data Acquisition System (DAS), ADC 12 b 133k MICROWIRE™, QSPI™, Serial, SPI™ 20-SSOP Product ...

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Chip Sun Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products Crystal Oscillator, Crystal Resonator, Turing Fork Crystal, Tcxo, Vctcxo, Ceramic Resontor, Saw Component, Crystal Filter
Management System Certification ISO 9001
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays

Max186ccap+ China Electronics Component Comparison

	Quick View Chipsun Promotion Sale Max186ccap+ China Electronics Component Contact Now	Quick View Original IC Tpic6c595dr Pwr 8-Bit Shift Regis Tpic6c595drg4 Electronic Components Bom Service Contact Now	Sop Packaging Surface Mount 48 Wire Integrated Circuit Black Ceramic Fused Shell Contact Now	Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor Contact Now	Oxygen Free Copper Bonding Gasket Integrated Circuit Chip Packaging Shell Contact Now

Transaction Info
	Quick View Chipsun Promotion Sale Max186ccap+ China Electronics Component Contact Now	Quick View Original IC Tpic6c595dr Pwr 8-Bit Shift Regis Tpic6c595drg4 Electronic Components Bom Service Contact Now	Sop Packaging Surface Mount 48 Wire Integrated Circuit Black Ceramic Fused Shell Contact Now	Copper Composite Aluminum Bonding Transition Chip IC Electronic Components High-Precision Semiconductor Contact Now	Oxygen Free Copper Bonding Gasket Integrated Circuit Chip Packaging Shell Contact Now
Price	US $ 24.00-24.50/ Piece	US $ 0.20-1.00/ Piece	US $ 11.5/ Piece	US $ 0.2/ Piece	US $ 0.2/ Piece
Min Order	500 Pieces	1 Pieces	100 Pieces	5000 Pieces	5000 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001	ISO 9001	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	-	-	-	-
Product Attributes
Specification	shape: -; Conductive Type: -; Integration: -; Technics: -; Part Number: Standard Edition; Description: Standard Edition; Detailed Description: Data Acquisition System (Das), ADC 12 B 133K Micro; Product Status: Active;	shape: -; Conductive Type: -;	shape: Flat; Conductive Type: Normal; Integration: Normal; Technics: Semiconductor IC; Heat Dissipation: Excellent; Obscurity: Excellent;	shape: DIP; Conductive Type: Normal; Integration: Normal; Technics: Semiconductor IC; Material: Copper Clad Aluminum Alloy; Performance: Bonding Force Greater Than 5g;	shape: DIP; Conductive Type: Normal; Integration: Normal; Technics: Semiconductor IC; Surface: Level; Oxidize: No Oxidation;
Supplier Name	Chip Sun Technology Co., Ltd.	Shenzhen Hongjilong Technology Co., Ltd.	Fuzhou Xinxu Technology Co., Ltd	Fuzhou Xinxu Technology Co., Ltd	Fuzhou Xinxu Technology Co., Ltd
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