Gzf-B18-a PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Video

Name: Gzf-B18-a PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker
Uploaded: 2022-07-07T14:26:30+08:00
Description: Brand COOKERMORE Board Size Double board Style Electronic chip IGBT Model GZF-B18-A Service Design the programme for you Using Range Induction cooker control panel led panel Supplier Type PCBA One-sto

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Price

Min. Order Reference FOB Price

500 Pieces US$35.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric CEM-3
Material Complex
Application Communication
Flame Retardant Properties HB
Mechanical Rigid Fexible
Processing Technology Delay Pressure Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Cookermore
Transport Package Box Packing
Specification 950*390*100mm
Trademark COOKERMORE
Origin China

Product Description

Brand COOKERMORE Board Size Double board Style Electronic chip IGBT Model GZF-B18-A Service Design the programme for you Using Range Induction cooker control panel led panel Supplier Type PCBA One-stop Service Min. Line Width 0.12 Certificate EMC/CE/CB/GS standard Base Material ...

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Guangdong Cookermore CO., Ltd

Diamond Member Since 2020

Audited Supplier

Rating & Reviews： 5.0/5.0

(3 Reviews)

Business Type Manufacturer/Factory
Main Products Gas Stove, Gas Water Heater, Range Hood, Induction Cooker, Infrared Cooker, Gas Hob, Gas Cooker, Induction Cooktop, Ih PCBA, Induction Cooker PCBA
Registered Capital 500000 RMB
Plant Area 12000 square meters
Main Markets North America, South America, Southeast Asia
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months

PCBA Customized Service Comparison

	Quick View Gzf-B18-a PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Electronic Contract Manufacturing for Printed Circuit Board Assembly Contact Now	Quick View Full Turnkey PCB Assembly Contract Manufacturing Contact Now	Quick View PCBA Manufacturer Custom Develop PCB Charger USB Board Charger PCB Assembly for Automobile Contact Now	Quick View Electronic EMS Manufacturer PCBA Circuit Board SMT DIP PCBA Assembly Service Contact Now

Transaction Info
	Quick View Gzf-B18-a PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Electronic Contract Manufacturing for Printed Circuit Board Assembly Contact Now	Quick View Full Turnkey PCB Assembly Contract Manufacturing Contact Now	Quick View PCBA Manufacturer Custom Develop PCB Charger USB Board Charger PCB Assembly for Automobile Contact Now	Quick View Electronic EMS Manufacturer PCBA Circuit Board SMT DIP PCBA Assembly Service Contact Now
Price	US $ 35/ Piece	US $ 0.20-20.00/ Piece	US $ 0.20-20.00/ Piece	US $ 1.03-6.00/ Piece	US $ 6.28-18.00/ Piece
Min Order	500 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Southeast Asia	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 3-6 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Guangdong Cookermore CO., Ltd	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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