MOSFET
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What is electronic components N-channel MOSFET JMTL3N10A SOT-23

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

100000 Pieces Negotiable

Sepcifications

  • Transport Package Box
  • Origin China
  • Manufacturing Technology Discrete Device
  • Material Element Semiconductor
  • Type N-type Semiconductor
  • Signal Processing Analog Digital Composite and Function
  • Package SOT-23
  • Application electronic product
  • Batch Number 2022+
  • Model JMTL3N10A

Product Description

Product Description Features 100V,3A RDS(ON) =180mR (Typ.) @ VGS =10V RDS(ON) =210mR (Typ.) @ VGS =4.5V High Density Cell Design for Ultra Low RDS(ON) Fully Characterized Avalanche Voltage and Current Excellent Package for Good Heat Dissipation Application Uninterruptible Power ...

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MOSFET Comparison
Transaction Info
Price Negotiable US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece
Min Order 100000 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Discrete Device;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Signal Processing: Analog Digital Composite and Function;
Package: SOT-23;
Application: electronic product;
Batch Number: 2022+;
Model: JMTL3N10A;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Supplier Name

Kunshan Huateng Electronics Co., Ltd.

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier