T1
US$133.00-285.00 / Piece
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What is High Hashrate Asic Mine T1 32th 2880W Btc Laptop Graphics Card Rx 5700 Xt Server Host T1

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$133.00-285.00 / Piece

Sepcifications

  • Graphics Card Integrated Graphics Card
  • Video Memory Capacity 8GB
  • Interface Type PCI Express 4.0 16X
  • Video Memory Type Gddr6
  • Output Type HDMI
  • Chip AMD
  • Memory Bus 256 Bit
  • Bus Standard PCI Express 4.0
  • Heat Dispatch Method Fan HeatSink
  • 3D API Directx 12, Opengl 4.6
  • Transport Package Factory Original Package
  • Specification 335 × 155 × 125 cm
  • Trademark Brand Mix
  • Origin Shenzhen China
  • Model T1
  • Weight 8kg
  • Algorithm Sha 256
  • Hashrate 32th/S
  • Consumption 2960W
  • Efficiency 0.0925j/Gh

Product Description

Product Description High Hashrate Asic Mine T1 32Th 2880W Btc Laptop Graphics Card Rx 5700 Xt Server Host T1 Model T1 is SHA-256 algorithm with a maximum hashrate of 32Th/s for a power consumption of 3250W. Asic Mine T1 Detailed Description: Model T1 Size 335 x 155 x 125mm Weight 8kg ...

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T1 Comparison
Transaction Info
Price US $ 133.00-285.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, btc, usdt, eth L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue US $5 Million - US $10 Million - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 8GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6;
Output Type: HDMI;
Chip: AMD;
Memory Bus: 256 Bit;
Bus Standard: PCI Express 4.0;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12, Opengl 4.6;
Model: T1;
Weight: 8kg;
Algorithm: Sha 256;
Hashrate: 32th/S;
Consumption: 2960W;
Efficiency: 0.0925j/Gh;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful ;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful ;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Supplier Name

Shenzhen Dovina Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier