What is PCB, Rigid PCB, Printed Circuit Board

Name: PCB, Rigid PCB, Printed Circuit Board
Uploaded: 2024-03-09T09:48:23+08:00
Description: Product Description Factory Photos Company Profile TECircuit founded in 2004, is a proficient PCB&PCBA manufacturer as a National High-Tech Enterprise. Based on our PCB factory in Hui

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Price

Min. Order Reference FOB Price

1 Piece US$1.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Automative
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Tecircuit
Specification 202*91.5
Trademark Tecircuit
Origin China

Product Description

Product Description Factory Photos Company Profile TECircuit founded in 2004, is a proficient PCB&PCBA manufacturer as a National High-Tech Enterprise. Based on our PCB factory in Huizhou, Guangdong, we produce 1-40L PCB precisely and densely. Along with our 6 SMT lines, we ...

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Shenzhen Tecircuit Electronic Limited

Gold Member Since 2024

Audited Supplier

Business Range Electrical & Electronics, Packaging & Printing
Main Products Rigid PCB, Flex PCB, HDI PCB, Gold Finger PCB, High Frequency PCB, PCBA, Electronic Components
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
OEM/ODM Availability Yes

PCB Comparison

	Quick View PCB, Rigid PCB, Printed Circuit Board Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now	Quick View 8layer 1.6mm Enig Min. Hole to Line 7.3mil Impedance Control Power Board PCB Contact Now	PCB Board 8layer Enig Pad in Via 0.2mm Thickness 1.66mm Min. Space 3mil PCB Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now

Transaction Info
	Quick View PCB, Rigid PCB, Printed Circuit Board Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now	Quick View 8layer 1.6mm Enig Min. Hole to Line 7.3mil Impedance Control Power Board PCB Contact Now	PCB Board 8layer Enig Pad in Via 0.2mm Thickness 1.66mm Min. Space 3mil PCB Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now
Price	US $ 1/ Piece	US $ 0.26-3.40/ Piece	US $ 0.22-2.85/ Piece	US $ 0.28-3.10/ Piece	US $ 0.28-3.10/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: OSP; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Pad in Via: 0.2mm; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7.3mil; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 6.2mil; Min. Space: 3mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Fr4 Tg150; Min. Space: 3.9mil;
Supplier Name	Shenzhen Tecircuit Electronic Limited	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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