What is Rigid Printed Circuit Board La

Name: Rigid Printed Circuit Board La
Uploaded: 2024-03-28T16:14:56+08:00
Description: Factory Photos Company Profile TECircuit founded in 2004, is a proficient PCB&PCBA manufacturer as a National High-Tech Enterprise. Based on our PCB factory in Huizhou, Guangdong, we

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Automative
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Metal
Insulation Materials Organic Resin
Brand Tecircuit
Specification 202*91.5
Trademark Tecircuit
Origin China

Product Description

Factory Photos Company Profile TECircuit founded in 2004, is a proficient PCB&PCBA manufacturer as a National High-Tech Enterprise. Based on our PCB factory in Huizhou, Guangdong, we produce 1-40L PCB precisely and densely. Along with our 6 SMT lines, we are remarkable in PCBA among ...

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Shenzhen Tecircuit Electronic Limited

Gold Member Since 2024

Audited Supplier

Business Range Electrical & Electronics, Packaging & Printing
Main Products Rigid PCB, Flex PCB, HDI PCB, Gold Finger PCB, High Frequency PCB, PCBA, Electronic Components
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
OEM/ODM Availability Yes

PCB Comparison

	Quick View Rigid Printed Circuit Board La Contact Now	High Frequency Ccl Material Printed Circuit Board Rigid PCB High Performance Contact Now	Manufacturer 1.6mm Single Side Copper Clad Laminated Fr4 Ccl for PCB High Performance Contact Now	China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB High Performance Contact Now	Best Sellers Copper Clad Laminated B Grade Fr4 Ccl for PCB Premium Contact Now

Transaction Info
	Quick View Rigid Printed Circuit Board La Contact Now	High Frequency Ccl Material Printed Circuit Board Rigid PCB High Performance Contact Now	Manufacturer 1.6mm Single Side Copper Clad Laminated Fr4 Ccl for PCB High Performance Contact Now	China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB High Performance Contact Now	Best Sellers Copper Clad Laminated B Grade Fr4 Ccl for PCB Premium Contact Now
Price	US $ 1/ Piece	Negotiable	Negotiable	Negotiable	Negotiable
Min Order	1 Pieces	50 Square Meters	50 Square Meters	50 Square Meters	50 Square Meters
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Paypal	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	-	-	-	-
Trade Capacity
Export Markets	-	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe
Annual Export Revenue	-	> US $100 Million	> US $100 Million	> US $100 Million	> US $100 Million
Business Model	OEM, ODM	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Metal; Insulation Materials: Organic Resin; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;
Supplier Name	Shenzhen Tecircuit Electronic Limited	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.
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