What is Industrial Welding Powder Waterproof and Dampproof Thermit Welding Powder Exothermic Welding Powder

Name: Industrial Welding Powder Waterproof and Dampproof Thermit Welding Powder Exothermic Welding Powder
Uploaded: 2022-11-24T21:21:17+08:00
Description: Product Description Product Name Exothermic welding powder/Thermit welding powder Usage Welding material Application Lightning protection, Grounding and surge protection Material Copper oxide, Aluminu

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Price

Min. Order Reference FOB Price

100 Bags US$1.00-1.50 / Bag

Sepcifications

state Powder
pH Neutral
Type Inorganic
Melting Point <200℃
Chemical Composition Copper Oxide, Aluminum Powder, Ect.
Function Protect Weld Metal
Application Electroslag Welding
Manufacturing Method Die Molded
Transport Package Carton ,Wooden Cases,Woven Bag,Plastic Bag Then PU
Specification Customized
Trademark EP
Origin Hebei, China

Product Description

Product Description Product Name Exothermic welding powder/Thermit welding powder Usage Welding material Application Lightning protection, Grounding and surge protection Material Copper oxide, Aluminum Oxide Copper Powder Weldable materials Pure copper, brass, bronze, red copper, copper ...

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Electric Powertek Company Ltd.

Gold Member Since 2022

Audited Supplier

Business Type Trading Company
Main Products Overhead Line Hardware, Aerial Electric Fittings, Pig Tail Hook, ABC Cable accessory
Number of Employees 9
Year of Establishment 2017-07-28
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Exothermic Welding Powder Comparison

	Quick View Industrial Welding Powder Waterproof and Dampproof Thermit Welding Powder Exothermic Welding Powder Contact Now	Quick View Lead Free 138 No Clean Soldering BGA Solder Paste Tin Bismuth Contact Now	Quick View High Quality Semiconductor Solder Paste for PCB Soldering 60/40 Contact Now	Quick View Syringe Solder Needle Soldering Paste 50g 50ml 50cc 100g 100ml 100cc 150g 150ml 150cc 200g 200cc 200ml Contact Now	Quick View Rma No Clean Leaded Solder BGA Paste 63/37 for Circuit Board Assembly Contact Now

Transaction Info
	Quick View Industrial Welding Powder Waterproof and Dampproof Thermit Welding Powder Exothermic Welding Powder Contact Now	Quick View Lead Free 138 No Clean Soldering BGA Solder Paste Tin Bismuth Contact Now	Quick View High Quality Semiconductor Solder Paste for PCB Soldering 60/40 Contact Now	Quick View Syringe Solder Needle Soldering Paste 50g 50ml 50cc 100g 100ml 100cc 150g 150ml 150cc 200g 200cc 200ml Contact Now	Quick View Rma No Clean Leaded Solder BGA Paste 63/37 for Circuit Board Assembly Contact Now
Price	US $ 1.00-1.50/ Bag	US $ 40/ kg	US $ 30/ kg	US $ 30/ kg	US $ 30/ kg
Min Order	100 Bags	50 kg	50 kg	50 kg	50 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS	-	-	-
Management System Certification	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	South America, Southeast Asia/ Mideast, Africa	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Powder; pH: Neutral; Type: Inorganic; Melting Point: <200℃; Chemical Composition: Copper Oxide, Aluminum Powder, Ect.; Function: Protect Weld Metal; Application: Electroslag Welding; Manufacturing Method: Die Molded;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for BGA Soldering;	state: Liquid; pH: Neutral; Type: Resin; Melting Point: <200℃; Chemical Composition: Tin Lead; Function: Remove Oxides; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for Semiconductor Soldering; Application 4: for PCB Assembly Soldering;	state: Liquid; pH: Neutral; Type: Resin; Melting Point: <200℃; Chemical Composition: Tin Lead; Function: Remove Oxides; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Storage: 0 to 10 Degree Celsius; Application 2: for Jetting Soldering; Application 3: for Automatic SMT Soldering;	state: Liquid; pH: Neutral; Type: Resin; Melting Point: <200℃; Chemical Composition: Tin Lead; Function: Remove Oxides; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for SMD Components Soldering; Application 4: for BGA Circuit Boards Assembly;
Supplier Name	Electric Powertek Company Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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