Multi-Layer PCB

US$0.10-15.00 / Piece

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Multilayer Enig PCB Board and Circuit Board PCB with Blind and Buried Vias in Shenzhen pictures & photos

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What is Multilayer Enig PCB Board and Circuit Board PCB with Blind and Buried Vias in Shenzhen

Name: Multilayer Enig PCB Board and Circuit Board PCB with Blind and Buried Vias in Shenzhen
Uploaded: 2022-09-19T17:55:04+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Exceeding
Transport Package Vacuum Package and Foam Protected
Specification PCB customized size
Trademark EEG
Origin Shenzhen
Certification RoHS, UL CE, GS, ISO
Delivery 24hours~5 Days
Service 7*24 Hours Online
Price Factory Price
Technology Enig, Gold Finger, Immersion Silver, Immersion Tin
Keyword Custom PCB
Product Name Multilayer PCB
MOQ 1 PCS

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Type of Ownership Limited Company
Plant Area 501~1000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949

Multi-Layer PCB Comparison

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Transaction Info
	Quick View Multilayer Enig PCB Board and Circuit Board PCB with Blind and Buried Vias in Shenzhen Contact Now	Quick View 8 Layer Circuit Board Medical Machine Green Soldermask Oil Cover Vias Gold Plated Surface Multilayer PCB Uses Contact Now	Quick View OEM Consumer Board 6layers OSP Surface Finish 0.25 Minimum Hole 3.5mil Line Width and Space Multilayer PCB Bonding Contact Now	Quick View Local Power 120 Micro Inches Shenjin Power Surface Finish High Frequency 3 Step HDI Multilayer PCB Coil for Industrial Device Contact Now	Quick View China Circuit Board Layout Design Double Sided Layer Manufacture Isola Arlon Nelco Immersion Silver Rogers PCB Manufacturers Contact Now
Price	US $ 0.10-15.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT
Quality Control
Product Certification	RoHS, UL CE, GS, ISO	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Technology: Enig, Gold Finger, Immersion Silver, Immersion Tin; Keyword: Custom PCB; Product Name: Multilayer PCB; MOQ: 1 PCS;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: Rogers Material; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: RO5880; Insulation Materials: Epoxy Resin; Brand: Kxpcba; Shape: Rectangular, Round, Slots, Cutouts, Complex; Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil; PCB Testing: E-Test, Fly Probe Test, Visual Checking; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Copper Thickness: 0.5-12oz(18-420um); Board Thickness: 0.2-6.0mm; Min. Line Width: 0.075mm(3mil); Min. Line Spacing: 0.075mm(3mil); Min Width of Annular Ring: 0.15mm(6mil); Service: 724 Hours Online;*
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
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