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US$0.10-10.00 / Piece
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What is OEM Multi Layer High Tg Immersion Gold Fr4 PCB Board for Electronics Product Project

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Exceeding
  • Transport Package Vacuum Package and Foam Protected
  • Specification HASL lead free, with peelable mask
  • Trademark EEG
  • Origin Shenzhen
  • Certification RoHS, UL CE, GS, ISO
  • Delivery 24hours~5 Days
  • Service 7*24 Hours Online
  • Price Factory Price
  • Keyword Custom PCB
  • Product Name Rigid PCB
  • MOQ 1 PCS
  • Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
  • Min. Line Width 0.075mm(3mil)
  • Copper Thicknes 0.5-12oz(18-420um)
  • Min. Line Spacin 0.075mm(3mil)
  • Board Thickness 0.2-6.0mm
  • Surface Finishing Immersion Silver, Tin, Gold /HASL Lead Free
  • One-Stop Service PCB Assembly, Component Supply
  • Testing Service 100% E-Testing

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Motherboard Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece
Min Order 1 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thicknes: 0.5-12oz(18-420um);
Min. Line Spacin: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier