5g High-Speed PCB
US$2.00-5.00 / Piece
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What is Advanced 5g Data Transfer Telecom Multilayer Printed Circuit Board 5g High-Speed PCB Manufacturing

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$3.00

1,000+ Pieces US$2.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Finestpcb
  • Transport Package Vacuum Package for Bare PCB and ESD Package
  • Specification customized
  • Trademark finest
  • Origin China
  • Service One-Step PCB Service
  • Solder Mask Color Blue.Green.Red.Black.White
  • Layer 1-40layers
  • Min BGA Ball Pitch 0.4mm
  • Surface Finishing HASL\OSP\Immersion Gold
  • HASL\OSP\Immersion Gold Fr4/Rogers/Aluminum/High Tg
  • Copper Thickness 0.5-5oz
  • Board Thickness 1.6 ±0.1mm
  • Minimum Hole Minimum
  • Minimum Width 3/3mil
  • Minimum Line 3/3mil
  • Product Name OEM PCB PCBA Board Assembly

Product Description

Product Title: Connectivity with our 5G High-Speed PCB Experience the pinnacle of high-speed connectivity with our state-of-the-art 5G High-Speed PCB, meticulously crafted to deliver unparalleled performance in the era of lightning-fast communication. Product Benefits: Blazing Data ...

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5g High-Speed PCB Comparison
Transaction Info
Price US $ 2.00-5.00/ Piece US $ 1.80-2.00/ Piece US $ 0.10-1.30/ pcs US $ 0.50-2.90/ pcs US $ 0.60-2.90/ pcs
Min Order 1 Pieces 10 Pieces 1 pcs 1 pcs 1 pcs
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T L/C, T/T L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Europe, East Asia(Japan/ South Korea) - North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM OEM OEM
Average Lead Time - - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Metal Core PCB;
Dielectric: Aluminium;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Hspcb;
Layers: Single;
Customized: Yes;
Thermal: High Thermal Conductivity;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Hspcb;
Customized: Yes;
Supplier Name

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hesheng Circuit Technology Limited

China Supplier - Diamond Member Audited Supplier