PCB Manufacturing
US$2.00-5.00 / Piece
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Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing pictures & photos
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What is Custom Multilayer PCB Assembly Circuit Boards Manufacturers Fr4 PCB Board Manufacturing

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$3.00

1,000+ Pieces US$2.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties 94V-0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Finestpcb
  • Transport Package Vacuum Package for Bare PCB and ESD Package
  • Specification customized
  • Trademark finest
  • Origin China
  • Service One-Step PCB Service
  • Solder Mask Color Blue.Green.Red.Black.White
  • Layer 1-40layers
  • Min BGA Ball Pitch 0.4mm
  • Surface Finishing HASL\OSP\Immersion Gold
  • HASL\OSP\Immersion Gold Fr4/Rogers/Aluminum/High Tg
  • Copper Thickness 0.5-5oz
  • Board Thickness 1.6 ±0.1mm
  • Minimum Hole Minimum
  • Minimum Width 3/3mil
  • Minimum Line 3/3mil
  • Product Name OEM PCB PCBA Board Assembly

Product Description

Finest Group was established in April 2003, focusing on PCB board manufacturing, SMT processing, and components support services. FINEST PCB Assemble Ltd is a subsidiary of FINEST Group. It was established on April 2019, specializing in EMS Processing, SMT quick-turn prototype, and small batch ...

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Transaction Info
Price US $ 2.00-5.00/ Piece US $ 0.10-20.00/ Piece US $ 0.20-0.60/ Piece US $ 0.20-0.60/ Piece US $ 0.20-0.60/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949
Trade Capacity
Export Markets North America, Europe, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - - OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - - - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.4mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 2oz/2oz;
Min Trace Width/Spacing: 5mil/5mil;
Special: Impedance Control, 25um Thick Cu of Pth;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name

Finest Pcb Assembly Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

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