Telecom HDI PCB

US$2.54-8.12 / Piece

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8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module pictures & photos

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What is 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module

Name: 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
Uploaded: 2023-07-05T08:58:53+08:00
Description: HDI Layer Count 4L-32L mass production, 34L-64L quick-turn Material High Tg material (Recommend Shengyi Material) Finished Board Thickness 0.8-4.8mm Finished Copper Thickness Hoz-8oz Max. Board Size

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About this Item

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$8.12

10,000+ Pieces US$2.54

Sepcifications

Structure Multilayer Rigid PCB
Dielectric Fr4 Em825 0.8/1.0mm
Material Epoxy Paper Laminate
Application Telecom
Flame Retardant Properties V0
Processing Technology Immersion Gold+OSP
Production Process Blind&Buried Vias
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum + Carton Packing
Origin Made in China
Layer Count 8layer HDI PCB 2+N+2
HDI Structure 1+N+1 to Any Layer
Min. Trace/Space 2/2mil
Blind/Buried Vias 0.1mm Laser Drilling

Product Description

HDI Layer Count 4L-32L mass production, 34L-64L quick-turn Material High Tg material (Recommend Shengyi Material) Finished Board Thickness 0.8-4.8mm Finished Copper Thickness Hoz-8oz Max. Board Size 600X800mm Min. Drilling Size 0.15mm, 0.1mm(laser drilling) Blind/Buried vias depth ratio ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Trading Company
Main Products Multilayer PCB; Rigid-Flex PCB; Components Sourcing; High-Frequency PCB; IC Products; EMS; PCB Assembly; SMT; DIP
Number of Employees 7
Year of Establishment 2011-09-22
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Telecom HDI PCB Comparison

	Quick View 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module Contact Now	Quick View DIP Assembly Multilayer PCB Board Contact Now	Quick View Professional Custom SMT Electronic PCB Assembly PCB Manufacturer Contact Now	Quick View PCB Printed Circuit Board Assembly Gh60 Staggeredprinted Mechanical Keyboard PCB Contact Now	Quick View High Quality Electronics 8layer Rigid PCB Tg170 1.6mm Enig Ipc Class 2 Contact Now

Transaction Info
	Quick View 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module Contact Now	Quick View DIP Assembly Multilayer PCB Board Contact Now	Quick View Professional Custom SMT Electronic PCB Assembly PCB Manufacturer Contact Now	Quick View PCB Printed Circuit Board Assembly Gh60 Staggeredprinted Mechanical Keyboard PCB Contact Now	Quick View High Quality Electronics 8layer Rigid PCB Tg170 1.6mm Enig Ipc Class 2 Contact Now
Price	US $ 2.54-8.12/ Piece	US $ 0.50-10.00/ Piece	US $ 0.50-10.00/ Piece	US $ 0.50-10.00/ Piece	US $ 0.50-10.00/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 0.8/1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer HDI PCB 2+N+2; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Usun Electronics Limited.,	Usun Electronics Limited.,	Usun Electronics Limited.,	Usun Electronics Limited.,
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