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It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module pictures & photos

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What is It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module

Name: It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module
Uploaded: 2023-07-05T08:58:31+08:00
Description: Layers: 16L Thickness: 1.89mm Materital: IT158 Outer Copper: 35um Inner Copper:3 35um Min hole size: 0.25mm Min. Hole Wall Cu: 25um Min. trace/space: 0.075mm/0.0905mm Surface finish: Immersion Gold

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About this Item

Price

Min. Order Reference FOB Price

10 Pieces US$0.10 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Military
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum + Carton Packing
Origin Made in China
Layer Count 16L up to 60L
Board Thickness 1.89mm up to 8mm
Min Hole Size 0.25mm
Min. Hole Wall Cu 25um
Finished Copper 35um
Min. Trace/Space 0.075/0.0905mm
Surface Finish Immersion Gold

Product Description

Layers: 16L Thickness: 1.89mm Materital: IT158 Outer Copper: 35um Inner Copper:3 35um Min hole size: 0.25mm Min. Hole Wall Cu: 25um Min. trace/space: 0.075mm/0.0905mm Surface finish: Immersion Gold Au 2u" Application: Sensor amplifier RFID system Features: ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Circuit Board Comparison

	Quick View It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module Contact Now	Quick View Rigid Printed Circuit Board Mas Contact Now	Quick View Rigid Printed Circuit Board PDA Contact Now	Quick View Rigid Printed Circuit Board Ladz Contact Now	Quick View Rigid Printed Circuit Board Qszx Contact Now

Transaction Info
	Quick View It158 Material Costomize 16layer PCB Circuit Board for RFID Read and Write Module Contact Now	Quick View Rigid Printed Circuit Board Mas Contact Now	Quick View Rigid Printed Circuit Board PDA Contact Now	Quick View Rigid Printed Circuit Board Ladz Contact Now	Quick View Rigid Printed Circuit Board Qszx Contact Now
Price	US $ 0.1/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 1/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Paypal	T/T, Paypal	T/T, Paypal	T/T, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Military; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 16L up to 60L; Board Thickness: 1.89mm up to 8mm; Min Hole Size: 0.25mm; Min. Hole Wall Cu: 25um; Finished Copper: 35um; Min. Trace/Space: 0.075/0.0905mm; Surface Finish: Immersion Gold;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Metal; Insulation Materials: Organic Resin; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Metal; Insulation Materials: Organic Resin; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Metal; Insulation Materials: Organic Resin; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Metal; Insulation Materials: Organic Resin; Brand: Tecircuit;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited
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