UPS PCB

US$1.92-4.64 / Piece

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Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS pictures & photos

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What is Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS

Name: Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS
Uploaded: 2023-07-05T09:03:35+08:00
Description: Layers: 4L Thickness: 1.6mm Materital: IT158 Outer Copper Thickness: 3OZ Inner Copper Thickness: 1OZ Min hole size: 0.55mm Min. Hole Wall Cu: 30um Min. trace line/space: 0.46/12mm Surface finish: HAS

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About this Item

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$4.64

10,000+ Pieces US$1.92

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Power
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum + Carton Packing
Origin Made in China
Layer Count 8L up to 24L
Board Thickness 2.4mm up to 8mm
Min Hole Size 0.6mm
Min. Hole Wall Cu 30um
Finished Copper 3/3 Oz

Product Description

Layers: 4L Thickness: 1.6mm Materital: IT158 Outer Copper Thickness: 3OZ Inner Copper Thickness: 1OZ Min hole size: 0.55mm Min. Hole Wall Cu: 30um Min. trace line/space: 0.46/12mm Surface finish: HASL-LF Product Application: Power, Power Supply, Power Source Features: ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

UPS PCB Comparison

	Quick View Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS Contact Now	Quick View Rigid PCB Fv Contact Now	Quick View Rigid PCB Ka Contact Now	Quick View Rigid PCB Vf Contact Now	Quick View Rigid PCB OS Contact Now

Transaction Info
	Quick View Multilayer 3oz Copper It158 Circuit Board PCB for Power UPS Contact Now	Quick View Rigid PCB Fv Contact Now	Quick View Rigid PCB Ka Contact Now	Quick View Rigid PCB Vf Contact Now	Quick View Rigid PCB OS Contact Now
Price	US $ 1.92-4.64/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 1/ Piece	US $ 1/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Paypal	T/T, Paypal	T/T, Paypal	T/T, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Power; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8L up to 24L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.6mm; Min. Hole Wall Cu: 30um; Finished Copper: 3/3 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Tecircuit;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Automative; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Tecircuit;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited
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