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4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control pictures & photos

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What is 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control

Name: 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control
Uploaded: 2024-04-15T11:13:24+08:00
Description: Products: 4Layer PCB 1.0mm ENIG, min. space 2.8mil, BGA to line 2.5mil with impedance control PCBs Capabilities Max.Board Thickness: 10mm Min. Trace Width/Space: Inner 2.5/2.5mil, Outer 3/3mil Trace

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About this Item

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$28.00

10,000+ Pieces US$0.23

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4 Shengyi High Tg170
Insulation Materials Epoxy Resin
Brand 1
Transport Package Vacuum + Carton Packing
Specification 1
Trademark 1
Origin Made in China
Layer Count 4-36layer Through Hole Board
Surface Finish Immersion Gold
Hole Wall Cu Min. 20um
Standard Ipc II
Certificates RoHS CCC ISO

Product Description

Products: 4Layer PCB 1.0mm ENIG, min. space 2.8mil, BGA to line 2.5mil with impedance control PCBs Capabilities Max.Board Thickness: 10mm Min. Trace Width/Space: Inner 2.5/2.5mil, Outer 3/3mil Trace Width/Spacing Tolerance:±20%; ±10% for signal trace areas by special control ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

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Transaction Info
	Quick View 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control Contact Now	Quick View Custom Single Sided 4 Layer Prototype Multilayer Printed Circuit Board Assembly Manufacturer Contact Now	Quick View PCB Design and Prototyping Instant Quote PCB Assembly House Circuit Board Manufacturing Prototyping Companies Contact Now	Quick View China Custom High Quality Cheap Aluminum Backed Metal Core Rigid Flex PCB Prototype Manufacturer Contact Now	Quick View Printing Circuit Board Components SMT Electronics Manufacturing Quick Turn Low Volume PCB Assembly Supplier Contact Now
Price	US $ 0.23-28.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece	US $ 2.00-5.00/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4-36layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: 94V-0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited	Finest Pcb Assembly Limited
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