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US$0.24-3.20 / Piece

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8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB pictures & photos

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What is 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB

Name: 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB
Uploaded: 2024-04-15T18:02:54+08:00
Description: Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture

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About this Item

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$3.20

1,000+ Pieces US$0.24

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Paper Laminate
Application Medical Instruments
Flame Retardant Properties V0
Processing Technology Immersion Gold
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand 1
Transport Package 1
Specification Vacuum + Carton Packing
Trademark 1
Origin Made in China
Layer Count 8L
BGA Gap 3mil
Inner Core Material 0.1mm

Product Description

Company Profile welcome to visit gawinpcba.en.made-in-china.com Shanghai Gawin Electronic Technology Company, a specialized PCB manufacturer with one-stop service from PCB design to PCB manufacture to BOM components procurement to PCB Assembly toFinished Product testing. Ability Show ...

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Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products IC Products, Components Sourcing, EMS/PCB Assembly/SMT, Rigid-Flex PCB, High Speed PCB, High-Frequency PCB, Multilayer PCB/HDI PCB, Flexible PCB/FPC, Semconductor Test-Board, Load Board/Probe Card
Registered Capital 10000000 RMB
Plant Area 3000 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick Turn Top Multilayer PCB Laminate, Integrated Circuit PCB, Component Sourcing, SMT Contact Now	Quick Turn OEM CCTV Camera PCB, Electronics Components SMT DIP PCBA Contact Now	OEM PCB Fast Delivery Customized PCB Fabrication Electronics Components Sourcing PCB Assembly with Express Service Contact Now	OEM Fr4 Multilayer Printed Circuit Board Impedance Control Multilayer PCB Board Electronics Components Sourcing Contact Now

Transaction Info
	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick Turn Top Multilayer PCB Laminate, Integrated Circuit PCB, Component Sourcing, SMT Contact Now	Quick Turn OEM CCTV Camera PCB, Electronics Components SMT DIP PCBA Contact Now	OEM PCB Fast Delivery Customized PCB Fabrication Electronics Components Sourcing PCB Assembly with Express Service Contact Now	OEM Fr4 Multilayer Printed Circuit Board Impedance Control Multilayer PCB Board Electronics Components Sourcing Contact Now
Price	US $ 0.24-3.20/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	100 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; BGA Gap: 3mil; Inner Core Material: 0.1mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok;
Supplier Name	Shanghai Gawin Electronic Technology Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.
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