Specification |
Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: GB, ASTM;
Purity: >99.95%;
Alloy: Alloy;
Type: Nickel Alloy Powder;
Powder: Powder;
Sphericity: High Sphericity;
Liquidity: High Liquidity;
Oxygen Content: Low Oxygen Content;
Materials: In718, In939, In625, Gh3 128, Gh3 536;
Size Range: Optional;
Feature: Corrosion Resistance;
Colour: Silver and Grey;
Technology: Prep;
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Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, GB, DIN, BS, ASTM, AISI;
Purity: >99.95%;
Alloy: Alloy;
Type: Nickel Plate;
Powder: Not Powder;
Shape: Flat Sheet;
Fusing Point: 1300-1390;
Breadth: 1000mm;
Elongation (≥ %): 40;
Mqq: 1kg;
Tensile Strength: 690;
Yield Strength: 283;
Executive Standard: ASTM ASME;
Corrosion Resistance: Good;
Length: Customer Customization;
Mechanical Property: Stabilize;
Physical Property: Stabilize;
Chemical Property: Stabilize;
Apply: Oil and Gas Shipbuilding Food Processing;
ASTM Standard: B575 Sb575;
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Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, GB, DIN, BS, ASTM, AISI, ISO 9001;
Purity: 58%;
Alloy: Alloy;
Type: Nickel Wire;
Powder: Not Powder;
Density: 8.2;
Elongation: 20;
Sample: Free;
Max Continuous: 1150;
Technique: Cold Drawing;
Treatment: Hydrogen Annealing;
Surface: Bright;
Condition: Soft Annealed;
Tensile: 630~780;
Resistivity: 1.12+/5% Ohm/M;
Spool: DIN80 DIN100 DIN125;
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Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, GB, DIN, BS, ASTM, AISI, ISO 9001;
Purity: 44%;
Alloy: Alloy;
Type: CuNi Wire;
Powder: Not Powder;
Technique: Cold Drawing;
Treatment: Hydrogen Annealing;
Surface: Bright;
Condition: Soft Annealed;
Max Working Tem: 250c;
Resistivity: 0.15ohm/M;
Density: 8.9g/cm3;
TCR X10-6 / 0c (20~600 0c): <50;
Emf Vs Cu (μV/ 0c) (0~100 0c): -25;
Melting Point: 1100c;
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Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, GB, DIN, BS, ASTM, AISI, ISO 9001;
Purity: 44%;
Alloy: Alloy;
Type: CuNi Wire;
Powder: Not Powder;
Technique: Cold Drawing;
Treatment: Hydrogen Annealing;
Surface: Bright;
Condition: Soft Annealed;
Max Working Tem: 250c;
Resistivity: 0.15ohm/M;
Density: 8.9g/cm3;
TCR X10-6 / 0c (20~600 0c): <50;
Emf Vs Cu (μV/ 0c) (0~100 0c): -25;
Melting Point: 1100c;
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