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US$0.01-0.02 / Piece

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What is Professional PCB Board Manufacturer (1-36 layers) with Competitive Price

Name: Professional PCB Board Manufacturer (1-36 layers) with Competitive Price
Uploaded: 2023-07-11T15:45:56+08:00
Description: Printing Accuracy 0.01mm SMT Components 01005-BGA Screen Stencil Size/Max 737*737mm SMT Precision 0.01mm PCB size/max 500*500mm SMT Line 3 pressure 0.5-10eg DIP Line 1 air source 4-6kgf/cm2 SMT Capac

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About this Item

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$0.02

500+ Pieces US$0.01

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Anti-Static
Specification 55.5*66.7*1.2mm
Origin China
PCB Layers 4-Layers
OEM Assembly Supply
DIP Assembly Flowflow Welding+Hand Welding
SMT Assembly 0603-Qfp64
Test QC,Aoi,Fct,X-ray
The Fastest Delivery Time Sample(3-5/Day)
Electronic Components Keep a Large Stock of Goods
IC Program Burning Supply
Design Supply
Resistor-Capacitor 01005-1206
Electrostatic Comprehensive Protection

Product Description

Printing Accuracy 0.01mm SMT Components 01005-BGA Screen Stencil Size/Max 737*737mm SMT Precision 0.01mm PCB size/max 500*500mm SMT Line 3 pressure 0.5-10eg DIP Line 1 air source 4-6kgf/cm2 SMT Capacity 360000CPH PCB Weight 0-3kg DIP Capacity 100000CPH QC Personnel 5 AOI ...

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Shenzhen Haodley Technology Co., Ltd.

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCBA, Electronic Product Design, IC Programming, IC Chip, Diodes and Transistor, SMT, DIP, LED, FPC
Registered Capital 10 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001
Main Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe

PCB Comparison

	Quick View Professional PCB Board Manufacturer (1-36 layers) with Competitive Price Contact Now	Quick View Turnkey Solution PCBA Manufacturing Printed Circuit Board Assembly Contact Now	Quick View Quick Turn EMS Electronic Board Assembly Turnkey PCBA Assembly Contact Now	Quick View Bom Gerber Files PCBA Service One Stop Product Assembly Factory Printed Circuit Boards Custom PCB Assembly Manufacturer Contact Now	Quick View Fast Turn Prototype and Mass Production PCBA Assembly Surface Mount Circuit Board Contact Now

Transaction Info
	Quick View Professional PCB Board Manufacturer (1-36 layers) with Competitive Price Contact Now	Quick View Turnkey Solution PCBA Manufacturing Printed Circuit Board Assembly Contact Now	Quick View Quick Turn EMS Electronic Board Assembly Turnkey PCBA Assembly Contact Now	Quick View Bom Gerber Files PCBA Service One Stop Product Assembly Factory Printed Circuit Boards Custom PCB Assembly Manufacturer Contact Now	Quick View Fast Turn Prototype and Mass Production PCBA Assembly Surface Mount Circuit Board Contact Now
Price	US $ 0.01-0.02/ Piece	US $ 0.15-10.00/ Piece	US $ 0.15-10.00/ Piece	US $ 1.03-6.00/ Piece	US $ 0.15-10.00/ Piece
Min Order	100 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; PCB Layers: 4-Layers; OEM Assembly: Supply; DIP Assembly: Flowflow Welding+Hand Welding; SMT Assembly: 0603-Qfp64; Test: QC,Aoi,Fct,X-ray; The Fastest Delivery Time: Sample(3-5/Day); Electronic Components: Keep a Large Stock of Goods; IC Program Burning: Supply; Design: Supply; Resistor-Capacitor: 01005-1206; Electrostatic: Comprehensive Protection;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Haodley Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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