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US$0.01-0.02 / Piece
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Fr-4 Multilayer Electronic Circuit Board PCB Manufacturer in China with Competitive Price Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$0.02

500+ Pieces US$0.01

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Anti-Static
  • Specification 55.5*66.7*1.2mm
  • Origin China
  • PCB Layers 4-Layers
  • OEM Assembly Supply
  • DIP Assembly Flowflow Welding+Hand Welding
  • SMT Assembly 0603-Qfp64
  • Test QC,Aoi,Fct,X-ray
  • The Fastest Delivery Time Sample(3-5/Day)
  • Electronic Components Keep a Large Stock of Goods
  • IC Program Burning Supply
  • Design Supply
  • Resistor-Capacitor 01005-1206
  • Electrostatic Comprehensive Protection

Product Description

Printing Accuracy 0.01mm SMT Components 01005-BGA Screen Stencil Size/Max 737*737mm SMT Precision 0.01mm PCB size/max 500*500mm SMT Line 3 pressure 0.5-10eg DIP Line 1 air source 4-6kgf/cm2 SMT Capacity 360000CPH PCB Weight 0-3kg DIP Capacity 100000CPH QC Personnel 5 AOI ...

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PCB Comparison
Transaction Info
Price US $ 0.01-0.02/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece
Min Order 100 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 4-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier