Welding Flux Sj101

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About this Item

Price

Min. Order Reference FOB Price

1 Ton US$350.00-400.00 / Ton

Sepcifications

state Solid
pH Alkaline
Type Inorganic
Melting Point >600℃
Chemical Composition Sio2+TiO2=15-25
Function Protect Weld Metal
Application Submerged-arc Welding
Manufacturing Method Sintering
Transport Package Kraft Bag with Plastic Lining Inside
Specification 25Kgs/ Kraft Bag, 40Bags(1 Ton)/Plywood Pallet
Trademark PANDING
Origin Laiwu City, Shandong Province, China
Grain Size 10-60 Mesh
Quality System ISO9001:2000
OEM Offered
Performance Slag Easy Remove
Welding Wire Em12,Em12K,Eh14,EL8
Model Number Sj101
Usages Steel Structure
Color Gray
Welding Speed 120m/Hour
Standard Aws A5.17/5.23

Product Description

Welding Flux SJ101 SJ101 TECHNICAL DATA (1)Standard: AWS A5.17/5.23 F6A0-EL8 F6A2-EM12 F7A2-EM12K F7A4-EH14 EN760 SA FB 1 65 AC H5 (2)Description: SJ101 is an agglomerated fluoride-basic type flux. It is gray and round grain,mesh 10-60. it can be operated with AC and DC. ,the welding ...

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Shandong Hulin Welding Material Co., Ltd.

Gold Member Since 2015

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Submerged Arc Welding Flux, Welding Flux, Welding Powder, Agglomerated Flux, Saw Flux, Saw Wire, MIG Wire, Welding Wire, Welding Consumables, Welding Materials
Management System Certification ISO 9001

Submerged Arc Welding Flux Comparison

	Welding Flux Sj101 Contact Now	Quick View Pewter Type 5 T3 T4 T5 Tin Lead Solder Paste 6337 for Pcbs Contact Now	Quick View Tin Alloy Sn99AG0.3cu0.7 T3 Powder Pb Free High Temperature Solder Paste 500g Contact Now	Quick View Easy BGA Reballing Mechanic Ppd Tin Lead Solder Paste 183 for Electrical Work Contact Now	Quick View Best No Clean Low Temperature 138c High Temp 183c LED Ppd SMD BGA SMT PCB Reflow Soldering Sn63pb37 Sac305 Lead Free Tin Solder Paste for Electronics Type 3 4 5 Contact Now

Transaction Info
	Welding Flux Sj101 Contact Now	Quick View Pewter Type 5 T3 T4 T5 Tin Lead Solder Paste 6337 for Pcbs Contact Now	Quick View Tin Alloy Sn99AG0.3cu0.7 T3 Powder Pb Free High Temperature Solder Paste 500g Contact Now	Quick View Easy BGA Reballing Mechanic Ppd Tin Lead Solder Paste 183 for Electrical Work Contact Now	Quick View Best No Clean Low Temperature 138c High Temp 183c LED Ppd SMD BGA SMT PCB Reflow Soldering Sn63pb37 Sac305 Lead Free Tin Solder Paste for Electronics Type 3 4 5 Contact Now
Price	US $ 350.00-400.00/ Ton	US $ 20.00-60.00/ kg	US $ 30.00-80.00/ kg	US $ 20.00-60.00/ kg	US $ 30.00-80.00/ kg
Min Order	1 Tons	30 kg	30 kg	30 kg	30 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	-	RoHS	-	RoHS
Management System Certification	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: 1 Month(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Solid; pH: Alkaline; Type: Inorganic; Melting Point: >600℃; Chemical Composition: Sio2+TiO2=15-25; Function: Protect Weld Metal; Application: Submerged-arc Welding; Manufacturing Method: Sintering; Grain Size: 10-60 Mesh; Quality System: ISO9001:2000; OEM: Offered; Performance: Slag Easy Remove; Welding Wire: Em12,Em12K,Eh14,EL8; Model Number: Sj101; Usages: Steel Structure; Color: Gray; Welding Speed: 120m/Hour; Standard: Aws A5.17/5.23;	state: Solid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Pb; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for Pcbs Manufacturing; Application 3: for LED Lighting Chips Soldering;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for PCBA Soldering;	state: Liquid; pH: Neutral; Type: Resin; Melting Point: <200℃; Chemical Composition: Tin Lead; Function: Remove Oxides; Application: SMT; Manufacturing Method: Non-melting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: SMD;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Application 2: SMD Soldering; Application 3: SMT Soldering; Packing: in Jars or Syringes; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius;
Supplier Name	Shandong Hulin Welding Material Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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