Gallium Nitride (GaN) Single Crystal

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-100.00 / Piece

Sepcifications

  • Manufacturing Technology Optoelectronic Semiconductor
  • Material Compound Semiconductor
  • Type N-type Semiconductor
  • Application Television
  • Brand Finewin
  • Transport Package Box
  • Specification 2INCH
  • Trademark FineWin
  • Origin Jiaozuo City Henan Province
  • Materials Gallium Nitride Substrates
  • Thickness 350um
  • Size 2inch to 4 Inch

Product Description

Gallium Nitride (GaN) Single Crystal 1. What is GaN substrates Gallium Nitride is one kind of wide-gap compound semiconductors. It is made with original HVPE method and wafer processing technology, which has been originally developed for many years. 2.Application Laser diodes for Blu-ray ...

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GaN Wafers Comparison
Transaction Info
Price US $ 1.00-100.00/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece US $ 0.50-8.80/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Application: Television;
Brand: Finewin;
Materials: Gallium Nitride Substrates;
Thickness: 350um;
Size: 2inch to 4 Inch;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Logic IC;
Material: Compound Semiconductor;
Type: N-type Semiconductor;
Package: BGA;
Signal Processing: Digital;
Application: Temperature Measurement;
Model: ST;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Structure: Multilayer Rigid PCB;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Type: N-type Semiconductor;
Package: DIP(Dual In-line Package);
Signal Processing: Simulation;
Application: Solar Cell;
Batch Number: 2023;
Dielectric: Fr-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Thickness: 2mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 4/4mil;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Supplier Name

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier