From China Printed Recycling of Printed Circuit Boards

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$1.00

1,000-4,999 Pieces US$0.80

5,000+ Pieces US$0.60

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric FR-4
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Copper-Based
  • Brand Hometech
  • Transport Package Carton Box with Bubble Pack,Vacuum Packing/Blister
  • Trademark OEM
  • Origin Ningbo China
  • Delivery 2 Weeks
  • PCBA QC X-ray,Aoi Test,Function Test(100% Test)

Product Description

Product Description Product Parameters Max panel size 32" x 20.5"(800mm x 520mm) Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm) Min PAD (inner layer) 5 mil(0.13mm) Min thickness(inner layer) 4 mil(0.1mm) Inner copper thickness 1~4 oz Outer copper thickness 0.5~6 oz ...

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PCB Comparison
Transaction Info
Price US $ 0.60-1.00/ Piece US $ 0.43-0.67/ Piece US $ 0.43-0.67/ Piece US $ 0.43-0.67/ Piece US $ 0.43-0.67/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram, WeChat/Alipay L/C, T/T, D/P, Western Union, Paypal, Money Gram, WeChat/Alipay L/C, T/T, D/P, Western Union, Paypal, Money Gram, WeChat/Alipay L/C, T/T, D/P, Western Union, Paypal, Money Gram, WeChat/Alipay
Quality Control
Product Certification - UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
Management System Certification ISO 9001, BSCI ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hometech;
Delivery: 2 Weeks;
PCBA QC: X-ray,Aoi Test,Function Test(100% Test);
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Supplier Name

Ningbo Hometech Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier