PCBA Manufacturing Service Electronics Manufacturer Assembly SMT DIP

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$30.00

10+ Pieces US$20.00

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT+DIP
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bag + Foam Protective Cotton + Cardboa
  • Specification 250x300mm
  • Trademark Hongzhou
  • Origin Shenzhen
  • Testing Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.
  • Min. Component 01005
  • Max. PCB Mulitylayer up to 64 Layers
  • Max PCB Dimension 740*400mm
  • MOQ Orders of Small or Medium Quantity Is Welcomed

Product Description

Hongzhou Electronics, a member of Hongzhou Group, we are ISO9001, ISO13485, IATF16949 certified factory. We specialize in high-quality PCBA and electronic manufacturing services. Our product includes Self Service Kiosk, Smart POS, and Conferencing System such as PTZ camera, HD Video Conference ...

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PCBA Comparison
Transaction Info
Price US $ 20.00-30.00/ Piece US $ 0.99-9.99/ Piece US $ 0.99-9.99/ Piece US $ 2/ Piece US $ 0.99-9.99/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT
Quality Control
Product Certification RoHS, ISO ISO ISO RoHS, ISO ISO
Management System Certification ISO 9001, IATF16949, ISO 13485 - - ISO 9001 -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM OEM, ODM, Own Brand
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Smaller Packages: 01005;
BGA: 0.1mm;
Waterproof PCBA: Parylene;
Assembly Way: SMT, DIP or Mixed;
PCBA Test Way: Aoi, Ict, Fct and Function Testing;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 0201;
Spi: Yes;
Visual Inspection: Yes;
Aoi: Yes;
X-ray: Yes;
Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Smaller Packages: 01005;
BGA: 0.1mm;
Waterproof PCBA: Parylene;
Assembly Way: SMT, DIP or Mixed;
PCBA Test Way: Aoi, Ict, Fct and Function Testing;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 0201;
Spi: Yes;
Visual Inspection: Yes;
Aoi: Yes;
X-ray: Yes;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4, FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Smaller Packages: 01005;
BGA: 0.1mm;
Waterproof PCBA: Parylene;
Assembly Way: SMT, DIP or Mixed;
PCBA Test Way: Aoi, Ict, Fct and Function Testing;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 0201;
Spi: Yes;
Visual Inspection: Yes;
Aoi: Yes;
X-ray: Yes;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier