Printed Circuit Board Assembly
US$0.20-20.00 / Piece
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Electronic Equipment Circuit Board with SMT DIP Technology Services Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$0.20-20.00 / Piece

Sepcifications

  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

Electronic Equipment Circuit Board with SMT DIP Technology Services Specification: PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, ...

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Printed Circuit Board Assembly Comparison
Transaction Info
Price US $ 0.20-20.00/ Piece US $ 0.1/ Piece US $ 1,450.00-1,845.00/ Piece US $ 245.00-385.00/ Piece US $ 2.70-2.80/ Piece
Min Order 10 Pieces 1 Pieces 2 Pieces 2 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, D/P, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal T/T
Quality Control
Product Certification RoHS, CCC, ISO - - - -
Management System Certification ISO 9001, IATF16949, ISO 13485 ISO 9001 ISO 9001 ISO 9001 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia -
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1-3 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 1-3 Month(s)
Peak-season: 6-12 Month(s)
-
Product Attributes
Specification
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, 100% E-Test, Aoi, RoHS;
MOQ: No MOQ, 1PCS Is Okay;
Stock Material: Shengyi, Fr4,Pi,Alu,Rogers, Arlon, Taconic, Isola;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Power Plant;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Yoyik;
Condition: New;
Input Board: 100471-03;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Power Plant;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Bently;
Condition: New;
Input Board: Jd194-BS5u;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm, Rogers;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Dongfang Yoyik (Deyang) Engineering Co., Ltd.

China Supplier - Gold Member Audited Supplier

Dongfang Yoyik (Deyang) Engineering Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier