OEM PCB Boards Turnkey Electronic Printed Circuit Board Assembly Service Video

Name: OEM PCB Boards Turnkey Electronic Printed Circuit Board Assembly Service
Uploaded: 2024-03-13T18:11:55+08:00
Description: OEM PCB Boards Turnkey Electronic Printed Circuit Board Assembly Service Specification PCB capability and services: 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competi

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.56

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

OEM PCB Boards Turnkey Electronic Printed Circuit Board Assembly Service Specification PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High TG, ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Registered Capital 147802.18 USD
Plant Area 3200 square meters
Management System Certification ISO9001:2015
OEM/ODM Availability Yes

Printed Circuit Board Assembly Comparison

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Transaction Info
	Quick View OEM PCB Boards Turnkey Electronic Printed Circuit Board Assembly Service Contact Now	Quick View High Density 10-Layer Multilayer PCB Design Contact Now	Quick View Multilayer PCB Board for High-Density Electronics Contact Now	Quick View Fast Produce FPC Manufacturer Flex PCBA FPCB Assembly FPC Contact Now	Quick View PCB Circuit Board Electronic FPC Cable FPC Connector FPC Contact Now
Price	US $ 0.56-5.00/ Piece	US $ 0.55-0.60/ Piece	US $ 4.80-5.00/ Piece	US $ 0.20-26.80/ Piece	US $ 0.20-26.80/ Piece
Min Order	10 Pieces	10 Pieces	10 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Paypal, Money Gram	T/T	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets	Domestic	-	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	-	-	-	-
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 3mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Jhwl; Surface Finish: HASL,Enig,OSP; Solder Mask: Green/Black/White/Red/Blue/Yellow; Biggest Panel Size: 610mm508mm;* Hole Posito: +/-0.075mm(3mil) CNC Driling;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Jhwl; Surface Finish: HASL,Enig,OSP; Solder Mask: Green/Black/White/Red/Blue/Yellow; Biggest Panel Size: 610mm508mm;* Hole Posito: +/-0.075mm(3mil) CNC Driling;
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