PCB Assembly
US$0.65-5.00 / Piece
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Lead Free HASL PCB Assembly PCBA Manufacturer in Shenzhen Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.10

5,000+ Pieces US$0.65

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

Lead Free HASL PCB Assembly PCBA Manufacturer in Shenzhen Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and PCBA assembly drawing. Test ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.65-5.00/ Piece US $ 1.00-10.00/ Piece US $ 1.00-10.00/ Piece US $ 1.00-10.00/ Piece US $ 2.68-5.60/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T T/T T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay
Quality Control
Product Certification RoHS, CCC, ISO - - - RoHS/ISO9001/Ts16949/ISO14001/ISO13485
Management System Certification ISO 9001, IATF16949, ISO 13485 GMP GMP GMP ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM, ODM
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
- - - -
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCB: PCBA;
Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCB: PCBA;
Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCB: PCBA;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

China Supplier - Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

China Supplier - Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

China Supplier - Diamond Member Audited Supplier