Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Huixian;
|
Type: Aluminum PCB;
Flame Retardant Properties: 94V-0;
Dielectric: Aluminum Core PCB;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED, Lamp, Lighting;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 18um, 35um, 70um, 105um, 140um;
Minimum Hole: 3/3mil;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Thermal Conductivity: 1W, 2W, 2.5W, 3W, 8W, 12W;
PCB Thickness: 0.4~3.6mm;
|
Type: Aluminum PCB;
Flame Retardant Properties: 94V-0;
Dielectric: Aluminum Core PCB;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED, Lamp, Lighting;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 18um, 35um, 70um, 105um, 140um;
Minimum Hole: 3/3mil;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Thermal Conductivity: 1W, 2W, 2.5W, 3W, 8W, 12W;
PCB Thickness: 0.4~3.6mm;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Standard;
Dielectric: Standard;
Base Material: Standard;
Insulation Materials: Standard;
Processing Technology: Standard;
Application: Standard;
Mechanical Rigid: Standard;
Material: Standard;
Brand: Ckmcu;
Sku: 1006;
Place of Origin: China;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 6mil;
Surfaec Treatment: OSP;
|