Printed Circuit Board Assembly with Turnkey PCBA Board Design Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$8.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Origin China

Product Description

PRODUCT DESCRIPTION Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to 6.0mm(4 to 240mil) Minimum line width/space 0.076/0.076mm ...

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PCBA Comparison
Transaction Info
Price US $ 8/ Piece US $ 0.01-0.02/ Piece US $ 0.01-0.02/ Piece US $ 0.15-0.20/ Piece US $ 8.00-9.00/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T T/T L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, IATF16949 ISO 9001 ISO 9001 ISO 9001 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC, Aoi, Fct, X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 2-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: HD;
PCB Layer: 10-Layers;
Min. Line Width/Space: 0.15mm;
Min. Hole Size: 0.25mm;
Materials: Fr4;
Surface Finishing: Gold;
Test: Flying Probe/Electrical Logging;
Silkscreen: White;
Solder Mask Type: Green;
External Copper Thickness: 2oz;
Copper Thickness: 1-1/3oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fiberglass Epoxy;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Material Type: Fr4;
Layer Counts: 4--30;
Board Thickness: 0.6mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 3/4mil;
Surface Treatment Type: Immersion Gold; Immersion Tin;OSP +Hard Gold;
Supplier Name

Shenzhen Jia Cheng Electric Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Haodley Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Keep Moving Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier