PCB Fabrication
US$7.80-8.00 / Piece
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What is Printed Circuit Board for LED with White Soldermask

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$8.00

1,000+ Pieces US$7.80

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 110*62mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.15mm/0.2mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 3mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 4 Thickness: 4.0mm Material: FR4 S1000-2 Size: 110*62mm Surface treatment: Immersion gold Line width/spacing: 3/3mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: ...

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PCB Fabrication Comparison
Transaction Info
Price US $ 7.80-8.00/ Piece US $ 1.05-5.00/ Piece US $ 0.15-12.00/ Piece US $ 0.99/ Piece US $ 0.99/ Piece
Min Order 10 Pieces 10 Pieces 10 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T T/T, D/P, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets - Domestic Domestic - -
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
- -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 3mil;
Surfaec Treatment: Immersion Gold;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier