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US$3.91-3.92 / Piece
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What is Four Multilayer PCB Flex-Rigid Board for Consumer Goods Rfpc Fr4

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.92

1,000+ Pieces US$3.91

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 100*90mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of the ...

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Advanced PCB Technology Comparison
Transaction Info
Price US $ 3.91-3.92/ Piece US $ 0.55-26.00/ Piece Negotiable US $ 0.01-0.30/ Piece US $ 0.01-0.30/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, D/P, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal, 30 days net
Quality Control
Product Certification - - ISO9001, ISO14000, Ts16949.UL.RoHS - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM OEM
Average Lead Time - - Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Okey Circuit Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier