What is BGA PCB with Half Holes

Name: BGA PCB with Half Holes
Uploaded: 2023-11-06T22:43:32+08:00
Description: Specifications: Layers: 4 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 46*46mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Fi

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$0.50

1,000+ Pieces US$0.45

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 46*46mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment HASL

Product Description

Specifications: Layers: 4 Thickness: 0.6-1.6mm Material: FR4 KB6160 Size: 46*46mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: photosensitive green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

PCB with BGA Comparison

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Transaction Info
	Quick View BGA PCB with Half Holes Contact Now	Immersion Gold PCB, Mass Volume Electronics PCBA, Bluetooth Circuit Board PCB Assembly Contact Now	Immersion Gold PCB, Ceramic PCB, Electronics Motherboard Transistor IC Component Sourcing SMT PCBA Contact Now	Quick View Fast Delivery Quick Turn Fr4 OEM Immersion Gold Heavy Copper Electronics Circuit Board PCB Assembly and PCBA Contact Now	Fr4 Immersion Gold Multilayer PCB, Gold Finger 30u′′ Circuit Board Electronic Component SMT PCBA Contact Now
Price	US $ 0.45-0.50/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: HASL;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.
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