Advanced PCB Technology
US$3.91-3.92 / Piece
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What is Premium Double Multilayer PCB Board for High Frequency Communication with Immersion Gold

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.92

1,000+ Pieces US$3.91

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 100*90mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of ...

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Advanced PCB Technology Comparison
Transaction Info
Price US $ 3.91-3.92/ Piece US $ 0.325-9.80/ Piece US $ 0.29-8.70/ Piece US $ 0.36-9.50/ Piece US $ 0.5/ Piece
Min Order 10 Pieces 100 Pieces 100 Pieces 100 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - Ts16949 -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 11;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi High Tg170;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4-64layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Min. Trace Width/Space: 3/3mil;
Standard: Ipc II;
Type: Multilayer Board;
Dielectric: Fr4 Cem1 Cem3 Pi Flex-Rigid Al Cu etc;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex Flex-Rigid Rigid;
Base Material: Copper;
Guangdong: Shenzhen;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier