Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Product Type: Custom HDI PCBA;
Custom HDI PCBA: One-Stop Turnkey;
Application: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-58layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
MOQ: 1PCS;
Capacity: 1000000PCS Each Month;
Supplier Type: PCB, PCBA, FPC, HDI, Rfpc;
Package: Vacuum Bag+Carton;
Delivery Time: Sample Is Available Within 3days;
Keyword: OEM Contract Manufacturing PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Sthl;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-18 Layer;
Copper Thickness: 0.5oz-6oz;
Board Thickness: 0.2mm-4mm;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Consumer, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: PCBA/PCB Assembly/PCB Circuit Board;
Other Service: PCB/PCB Layout and Design, Engineering Support;
PCB Assembly Name: SMT Assembly Mobile Phone Accessory;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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