PCBA
US$2.00-4.50 / Piece
View
  • Recommend for you
  • What is High Quality Electronic Card / Printed Circuit Board / PCBA
  • What is PCBA Manufacturing Service Electronics Manufacturer PCB Assembly SMT&DIP Process PCBA with UL
  • What is Multilayer HDI Quick Turn Printed Circuit Board PCB&PCBA

What is Intelligent PCBA Manufacturing Doublesided Multilayer PCBA Fast Turnkey PCB Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-499 Pieces US$4.50

500-999 Pieces US$4.00

1,000-4,999 Pieces US$3.50

5,000-9,999 Pieces US$2.85

10,000+ Pieces US$2.00

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxide Woven Glass Fabric Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Jxpcba
  • Transport Package ESD Bag+Bubble Wrapped +Carton
  • Specification customized PCBA
  • Trademark jxpcba
  • Origin China
  • Layer 1-32 Layers
  • Board Thickness 0.2-8.0mm
  • PCBA Testing PCB: Ict Testing and Flying Probe Testing, PCBA: a
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
  • Qualified Ipc-a-610cclass 2 Standard
  • Thick Copper 18um-140um(4oz)
  • Service OEM/ODM, EMS

Product Description

PCB assembly OEM service Electronic components material purchasing Bare PCB fabrication PCB Assembly Service. (SMT, BGA, DIP) FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service Conformal coating service ...

Learn More

PCBA Comparison
Transaction Info
Price US $ 2.00-4.50/ Piece US $ 32/ Piece US $ 0.1/ Piece US $ 0.30-1.00/ Piece US $ 23/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA
Payment Terms T/T, Western Union, Paypal, Money Gram, Alipay, Alibaba Trade Assurance Order L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash
Quality Control
Product Certification - UL, RoHS, SGS, ISO 9001, Ect UL, RoHS, SGS, Ect RoHS, UL, SGS, Ect UL, RoHS, SGS, ISO 9001, Ect
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Others OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
Structure: Multilayer Rigid PCB;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Enig;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Surface Finishing: HASL Lead-Free;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
Layer: 1 to 24;
Shipping: UPS, FedEx, DHL, Ect;
Package: Vacuum;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Industrial Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Min Line Spacing: 0.2mm;
Min Line Width: 0.2mm;
Min Hole Size: 0.25mm;
Package: Vacuum;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: HASL;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Wigth: 0.075mm;
Min. Line Spacing: 0.075mm;
Color: Blue;
Size: 103mm*58mm;
Package: Vacuum;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 35um;
Solder Mask: White;
Silkscree: Black;
Layer: 1;
Min Hole Size: 0.2mm;
Min Line Spacing: 6mil;
Min Line Width: 6mil;
Thermal Conductivity: 4W;
Shipping: UPS, FedEx, DHL, Ect;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier