Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Service: PCB Prototype, Compoments Sourcing, PCB Assembly;
Layer: 1, 2, 4, 6, up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Mc PCB;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
PCB Thickness: 0.3mm-4mm;
PCB Size: 22inch*22inch;
Copper Thickness: 18um-210um(6oz);
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Enig;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Standard: Ipc-a-610, Ipc-a-620;
Profiling Punching: Routing, V-Cut, Beveling, Chamfer;
SMT Capability: 1206, 0805, 0603, 0402, 0201, 01005;
Test: Ict(in Circuit Test), Fct(Functional Circuit Test;
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Structure: Standard;
Dielectric: Standard;
Material: Standard;
Application: Consumer Electronics;
Flame Retardant Properties: Standard;
Processing Technology: Standard;
Production Process: Standard;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ckmcu;
Sku: 16g150;
Place of Origin: China;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, 100% E-Test, Aoi, RoHS;
MOQ: No MOQ, 1PCS Is Okay;
Stock Material: Shengyi, Fr4, Pi, Alu, Rogers, Arlon, Taconic, Isola;
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