| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
Certificate: ISO9001, ISO14001, IATF16949, ISO13485.;
Solder Mask Color: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-8.0mm;
Copper Thickness: 0.5-100oz(18-3500um);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: Industrial, Control Board, Motherboard.;
Design: PCBA Layout and Engineering Support.;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB;
PCBA Testing: in-Circuit Test (Ict), Functioal Test (Fct), X-ray;
Service: PCB, Components Sourcing, Assembly, Test, Package;
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Metal Coating: Standard;
Mode of Production: SMT;
Layers: Standard;
Base Material: Standard;
Customized: Customized;
Condition: New;
Power: 6W;
Number of Lamp Beads: 7PCS;
SMT Electrolysis 8000h: 3.3UF 400V;
Current: 18-20mA;
Supplier Type: One-Stop Service;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-5;
Customized: Customized;
Condition: New;
Soldermask Color: Green;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Customized: Customized;
Condition: New;
MOQ: 1 Piece;
Handing Standards: Ipc-a-600h, Ipc-a-610f, J-Std-001f;
Technical Support: Free Dfm/a Check, Bom Analysis;
Assembly Abilities: SMT 5 Milli Points Per Day, DIP 10 Thousands Piec;
Assembly Details: 5 SMT + 2 DIP (Dust and Anti-Static Lines);
5 SMT + 2 DIP (Dust and Anti-Static Lin: PCB Design + PCB Fab + Components Sourcing + PCB;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming, W;
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