Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Product Name: Turnkey PCB Assembly Services;
Quality Grade: Ipca610;
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
Shipping: by DHL, FedEx, UPS;
Solder Resist Color: Green;Red;Yellow;Black;White;
Solder Mask Color: Yellow;Black;White;;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
Design: Original;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 8;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4-S1000-2m;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Gold Plated;
Mini Hole Diameter: 0.25mm;
Borad Thickness: 2.0mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 3oz/3oz;
Min Trace Width/Spacing: 20mil / 20mil;
Special: 30u'' Thick Gold Plated, Withstand Voltage;
Certifications: ISO9001, ISO14001, CE, UL, RoHS, IATF16949 etc.;
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Type: Combining Rigid Circuit Board;
Material: Cu Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: Cu Substrate, Good Heat Dissipation for Power;
Certificated: ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 6;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/5mil;
Special: 5g Communication PCB Board, Big Gold Area;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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