PCB
US$1.00-4.00 / Piece
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What is High Quality Flex PCB Flexible PCB China Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Model FR-4
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer′s brand
  • Origin China

Product Description

Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company has ...

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PCB Comparison
Transaction Info
Price US $ 1.00-4.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal, Cash L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification - RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO RoHS, UL, ISO
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM, Others - - - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier