Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM PCB;
Product Name: Turnkey PCB Assembly Services;
PCBA Types: HDI PCBA, Rigid PCB, Rigid-Flex PCB, FPC;
Materials: Fr-4, Cem-1, Cem-3, Rogers, Al-Based Fr-4, Polyimi;
PCB Layer: 1-32 Layers;
Copper Thickness: 18um-210um(6oz);
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
Shipping: by DHL, FedEx, UPS;
Solder Resist Color: Green;Red;Yellow;Black;White;
Solder Mask Color: Yellow;Black;White;;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 6mil;
Surfaec Treatment: Tin Plated;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 4-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 4-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Layers: 4-Layers;
OEM Assembly: Supply;
DIP Assembly: Flowflow Welding+Hand Welding;
SMT Assembly: 0603-Qfp64;
Test: QC,Aoi,Fct,X-ray;
The Fastest Delivery Time: Sample(3-5/Day);
Electronic Components: Keep a Large Stock of Goods;
IC Program Burning: Supply;
Design: Supply;
Resistor-Capacitor: 01005-1206;
Electrostatic: Comprehensive Protection;
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