SMT Processing PCBA
US$2.18 / Piece
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What is Motherboard Circuit PCB SMT Processing PCBA with DIP Technology Electronics Component PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$2.18 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Jxpcba
  • Transport Package Air Bubble Film, Vacuum Package, ESD Bag+Carton
  • Specification custom
  • Trademark JXpcba
  • Origin China
  • MOQ at Least 1piece
  • Delivery Term Fob Shenzhen
  • Payment Term by T/T in Advance
  • Leadtime 15days After Receipt of Your Full Payment
  • Component Packing Tary, Tube, Tape
  • Number of Floors 1-32
  • Minimum Line Width/Spacing 3.0mil
  • Maximum Plate Thickness Aperture Ratio 30:1
  • Minimum Mechanical Drilling Aperture 6mil
  • Board Thickness 0.2mm~6.0mm
  • Maximum Board Size 640mm*1100mm
  • PCBA Test Static Test, Power-on Function Test, Power-on Agin
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop

Product Description

Shenzhen Jingxin Electronic Technology Co.,Ltd. Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 employees, more than 30 production ...

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SMT Processing PCBA Comparison
Transaction Info
Price US $ 2.18/ Piece Negotiable Negotiable Negotiable Negotiable
Min Order 10 Pieces 50 Square Meters 50 Square Meters 50 Square Meters 50 Square Meters
Trade Terms - - - - -
Payment Terms T/T, Paypal L/C, T/T L/C, T/T L/C, T/T L/C, T/T
Quality Control
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe
Annual Export Revenue - > US $100 Million > US $100 Million > US $100 Million > US $100 Million
Business Model OEM, ODM, Others Own Brand Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
MOQ: at Least 1piece;
Delivery Term: Fob Shenzhen;
Payment Term: by T/T in Advance;
Leadtime: 15days After Receipt of Your Full Payment;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier