Efficient Completion PCBA

US$0.68-1.68 / Piece

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What is Factory Direct Processing PCBA, Customized Size PCB Assembly, Efficient Completion of PCBA

Name: Factory Direct Processing PCBA, Customized Size PCB Assembly, Efficient Completion of PCBA
Uploaded: 2023-02-21T19:01:34+08:00
Description: Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate

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About this Item

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$1.68

100-999 Pieces US$1.29

1,000-1,999 Pieces US$1.01

2,000+ Pieces US$0.68

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Phenolic Paper Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Jxpcba
Transport Package Air Bubble Film, Vacuum Package, ESD Bag+Carton
Specification custom
Trademark JXpcba
Origin China
PCBA Material Fr4, High Tg, Halogen-Free, High Frequency
Surface Treatment HASL/Immersion Gold/Immersion Silver/Immersion Tin
Certificate ISO9001/ISO14001/CE/RoHS
PCB Solder Mask White, Black, Yellow, Green, Red, Blue
Component Packing Tary, Tube, Tape
Number of Floors 1-32
Minimum Line Width/Spacing 3.0mil
Maximum Plate Thickness Aperture Ratio 30:1
Minimum Mechanical Drilling Aperture 6mil
Board Thickness 0.2mm~6.0mm
Maximum Board Size 640mm*1100mm
PCBA Test Static Test, Power-on Function Test, Power-on Agin
PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
PCBA Testing Service Aoi, Ict, X-ray, Flying Probe Test
Product Application Consumer Electronics/Home Appliances/Medical Equip

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, Circuit Board, FPC, HDI PCB
Registered Capital 16000000 RMB
Management System Certification ISO 9001, ISO 14000, IATF16949, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Efficient Completion PCBA Comparison

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Transaction Info
	Quick View Factory Direct Processing PCBA, Customized Size PCB Assembly, Efficient Completion of PCBA Contact Now	PCB Assembly Electronics Immersion Gold PCB Board, Hard Gold PCB Plating Gold Finger Manufacturing Contact Now	OEM Fr4 Immersion Gold Multilayer PCB Bare Board Manfacturing PCB Assembly Contact Now	EMS Turnkey SMD PCB Circuit Board Assembly SMT PCBA Electronics Manufacturing Contact Now	Gold Finger Enig PCB 4-32 Layer Fr4 Electronic Circuit Board Component Sourcing SMT PCB Assembly Contact Now
Price	US $ 0.68-1.68/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	10 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO9001/ISO14001/CE/RoHS	-	-	-	-
Management System Certification	ISO 9001, ISO 14000, IATF16949, GMP	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Others	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Jxpcba; PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency; Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin; PCB Solder Mask: White, Black, Yellow, Green, Red, Blue; Component Packing: Tary, Tube, Tape; Number of Floors: 1-32; Minimum Line Width/Spacing: 3.0mil; Maximum Plate Thickness Aperture Ratio: 30:1; Minimum Mechanical Drilling Aperture: 6mil; Board Thickness: 0.2mm~6.0mm; Maximum Board Size: 640mm1100mm;* PCBA Test: Static Test, Power-on Function Test, Power-on Agin; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test; Product Application: Consumer Electronics/Home Appliances/Medical Equip;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.
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