OSP, Immersion Gold, Immersion Tin, Immersion AG Epoxide Woven Glass Fabric Laminate Ccl Sheet PCB Video

Name: OSP, Immersion Gold, Immersion Tin, Immersion AG Epoxide Woven Glass Fabric Laminate Ccl Sheet PCB
Uploaded: 2023-09-14T11:35:38+08:00
Description: Quick response, will reply Customer's any enquiry within 1 hours -24 hours technique Support. -24 hours Engineering Gerber files treatment. -24 hours English Engineering Questions Confirmation by E-ma

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About this Item

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$2.10

1,000-9,999 Pieces US$1.10

10,000+ Pieces US$0.95

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxide Woven Glass Fabric Laminate
Application Medical Instruments
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum Packaging
Specification 100*585
Trademark KING FIELD/OEM
Origin China
Certificate ISO9001, ISO16949, RoHS
Surface Treatment OSP, Immersion Gold, Immersion Tin, Immersion AG
Impedance Control Accuracy ±8%
Minimum Solder Resist Opening 1.5mil

Product Description

Quick response, will reply Customer's any enquiry within 1 hours -24 hours technique Support. -24 hours Engineering Gerber files treatment. -24 hours English Engineering Questions Confirmation by E-mail. -ExperiencedImpedance Designer. -Supply the best project fit for production customized. ...

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King Field Electronic Co., Ltd. (Shenzhen)

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCBA, Print Circuit Board, Flexible Circuit Board, PCB Assembly, Aluminum PCB, FPC, Multi-Layer PCB, PCB Board, Rigid-Flex Board
Registered Capital 5000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Quick View OSP, Immersion Gold, Immersion Tin, Immersion AG Epoxide Woven Glass Fabric Laminate Ccl Sheet PCB Contact Now	Electronical Control Panel PCB Board Contact Now	Quick View Enig, HASL PCB Circuits Manufacturing with High Quality Rigid-Flex Printed Circuit Board PCB Board for Electronics Contact Now	Quick View Customized PCB Service Print Circuits Board 94vo RoHS PCB Board Contact Now	Quick View Double Side Fr4 HASL PCB Contact Now

Transaction Info
	Quick View OSP, Immersion Gold, Immersion Tin, Immersion AG Epoxide Woven Glass Fabric Laminate Ccl Sheet PCB Contact Now	Electronical Control Panel PCB Board Contact Now	Quick View Enig, HASL PCB Circuits Manufacturing with High Quality Rigid-Flex Printed Circuit Board PCB Board for Electronics Contact Now	Quick View Customized PCB Service Print Circuits Board 94vo RoHS PCB Board Contact Now	Quick View Double Side Fr4 HASL PCB Contact Now
Price	US $ 0.95-2.10/ Piece	Negotiable	US $ 0.01-20.00/ Piece	US $ 0.01-100.00/ Piece	US $ 0.1/ Piece
Min Order	100 Pieces	1 Square Meters	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA	-	-	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO9001, ISO16949, RoHS	UL, SGS, RoHS, ISO 9001, Ect	-	-	RoHS, UL, SGS, Ect
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM	OEM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Copper Thickness: 1oz; Green Solder Mask: Green; Surface Finish: HASL-Lead Free; Board Thickness: 1mm; Min Hole Size: 0.6mm; Min Line Width: 4mil; Min Line Spacing: 4mil; Surface Finishing: Hal, Immersion Gold, Ect; Package: Vacuum;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V1; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fr4 Cem1 Cem3 Hight Tg, Fr4; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer: 1~24layers; Thickness: 1~4mm; Copper Thikss: 1 Oz/2oz; Use: LED, Computer, Device, Telecommunication; Surface Finishing: HASL, OSP, Lead Free HASL; Min. Line Spacing: 0.003", 0.15mm, 0.05 mm; Min. Hole Size: 0.25mm, 0.1mm, 6mil; Solder Mask Color: Green Black Red, Black.Red.Yellow.White.Blue.Green;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: HASL; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Blue; Size: 6656mm;* Package: Vacuum;
Supplier Name	King Field Electronic Co., Ltd. (Shenzhen)	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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