Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
MOQ: No;
Service: OEM ODM;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
|