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What is OEM Service Manufacturer RF PCB and Microwave Application Circuit Board Thick Film Ceramic PCB with ISO9001 ISO14001 IATF16949

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric AIN
  • Material Ain
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aln, Al2O3
  • Insulation Materials Aln, Al2O3
  • Model PCB
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification Custom during 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Shape Rectangular, Round, Slots, Cutouts, Complex
  • Surface Treatment Enig, Enepig, Immersion Silver
  • PCB Testing E-Test, Fly Probe Test, Visual Checking
  • Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
  • Copper Thickness 0.5-12oz(18-420um)
  • Board Thickness 0.2-6.0mm
  • Min. Line Width 0.075mm(3mil)
  • Min. Line Spacing 0.075mm(3mil)
  • Min Width of Annular Ring 0.15mm(6mil)
  • Outline Tolerance(mm) 0.05mm
  • Hole Tolerance 0.05mm

Product Description

Ceramic pcb Capability. Board Thickness(mm) 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm Layer Number 1-2L Base copper thickness(um) 18-300um(0.5-8.5oz) Min Track width/space(mm) 0.075mm Min hole size 0.06mm(PTH) Finished hole tolerance(mm) 0.05mm(NPTH) Outline Tolerance(mm) 0.05mm ...

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Alumina Substrate Suppliers Comparison
Transaction Info
Price US $ 0.10-9.99/ Piece US $ 1.00-4.00/ Piece US $ 1.00-4.00/ Piece US $ 1.00-4.00/ Piece US $ 1.00-4.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, Western Union, Paypal, Cash L/C, T/T, Western Union, Paypal, Cash L/C, T/T, Western Union, Paypal, Cash L/C, T/T, Western Union, Paypal, Cash
Quality Control
Management System Certification - ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Others OEM, ODM, Others OEM, ODM, Others OEM, ODM, Others
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier