Fr4 Multilayer PCB

US$0.10-10.00 / Piece

View

OEM Medical PCBA Service 94V0 Circuit Boards Other SMT and DIP Manufacturing Multilayer Metal Core PCB pictures & photos

Recommend for you
What is Customized PCBA Prototype Manufacturer Assembly Electronics Circuit Board PCB Design Service HDI PCB Material
What is Multilayer Fr-4 Blind and Buried Hole BGA Immersion Gold Circuit Board HDI PCB Market with Impedance Test Coupon
What is High Definition Silkscreen Gold Plating Halogen Free Fr4 High CTI HDI PCB Quote with Reasonable Price

What is OEM Medical PCBA Service 94V0 Circuit Boards Other SMT and DIP Manufacturing Multilayer Metal Core PCB

Name: OEM Medical PCBA Service 94V0 Circuit Boards Other SMT and DIP Manufacturing Multilayer Metal Core PCB
Uploaded: 2024-05-08T20:44:37+08:00
Description: HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum /

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Sy Fr4
Insulation Materials Organic Resin
Brand Kxpcba
Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
Specification 5-500mm
Trademark KX
Origin Shenzhen of China
Material Brand Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt
Copper Weights 0.5oz~10oz
Layer Count 1-64 Layers
Stack up Control Dielectric/Control Impedance/Tdr Testing
Surface Finish HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers
Vias Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res
Stack Via 5step
Stagger Via 5step
Laser Via Hole Size 0.1mm
Filling Via Dimple Value <=15um
Laser Via Capture Pad Size 0.25mm

Product Description

HDI pcb Capability. HDI PCB capability table Items Capability Circuit Constructions Single-Sided / Double-Sided / Multi-Layer / Flex / Rigid Flex Material FR-4 / Rogers / Arlon / Polymide / Aluminum / Kapt/etc Copper weights 0.5oz~10oz Layer Count 1-64 layers Stack up ...

Learn More

Shenzhen Jinxiong Electronic Co., Ltd

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB PCBA, Stencil
Export Year 2019-03-01
Terms of Payment T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram, XT
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Fr4 Multilayer PCB Comparison

	Quick View OEM Medical PCBA Service 94V0 Circuit Boards Other SMT and DIP Manufacturing Multilayer Metal Core PCB Contact Now	Double Side PCB with Immesion Gold Contact Now	Quick View 2-20 Layers Fr4 High Tg Fr4 PCB Board Customized Printed Circuit Board Contact Now	Quick View 4 Layers Electronics PCB/ Printed Circuit Boards in Green Printing Ink Contact Now	Quick View Customized 1oz Inner and 2oz Outer Copper Chem. Ni/Au 10 Layers PCB Circuit Contact Now

Transaction Info
	Quick View OEM Medical PCBA Service 94V0 Circuit Boards Other SMT and DIP Manufacturing Multilayer Metal Core PCB Contact Now	Double Side PCB with Immesion Gold Contact Now	Quick View 2-20 Layers Fr4 High Tg Fr4 PCB Board Customized Printed Circuit Board Contact Now	Quick View 4 Layers Electronics PCB/ Printed Circuit Boards in Green Printing Ink Contact Now	Quick View Customized 1oz Inner and 2oz Outer Copper Chem. Ni/Au 10 Layers PCB Circuit Contact Now
Price	US $ 0.10-10.00/ Piece	US $ 60.00-75.00/ Square Meter	US $ 0.01-100.00/ Piece	US $ 0.01-10.00/ Piece	US $ 0.01-10.00/ Piece
Min Order	1 Pieces	5 Square Meters	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T	L/C, T/T, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification	-	-	UL, ISO9001&ISO14001, SGS, RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
Management System Certification	-	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr-4; Insulation Materials: Organic Resin; Brand: Zapon; Surface: OSP,Immersion Gold,Hal Lead Free,Hal; Solder Mask: Green,Red,Yellow,White,Black,Blue,etc; Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS); Sample Date: 3-5days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u''; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 2-20layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Enig Thickness: 1-3u''; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Hard Gold Thickness: 5-50u''; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layer: 1-20layers;
Supplier Name	Shenzhen Jinxiong Electronic Co., Ltd	Zhejiang Dejia Electronics Technology Co.,Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
Select All

Contact Now

Hot Search