Specification |
Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Smaller Packages: 01005;
BGA: 0.1mm;
Waterproof PCBA: Parylene;
Assembly Way: SMT, DIP or Mixed;
PCBA Test Way: Aoi, Ict, Fct and Function Testing;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 0201;
Spi: Yes;
Visual Inspection: Yes;
Aoi: Yes;
X-ray: Yes;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Bladeless Fan PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Application: Home Appliances;
Certificate: ISO9001/ISO14001/CE/RoHS;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Bladeless Fan PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Application: Home Appliances;
Certificate: ISO9001/ISO14001/CE/RoHS;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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