2022 Trend Product 40kw Power Consumption Computer Immersion Cooling System for Sale

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1,088.00 / Piece

Sepcifications

  • Graphics Card Immersion Cooling Box
  • Video Memory Capacity 1024 MB
  • Interface Type PCI Express 3.0 16X
  • Video Memory Type DDR3
  • Output Type VGA
  • Chip nVIDIA
  • Memory Bus 256 Bit
  • Bus Standard PCI Express 2.0
  • Heat Dispatch Method Silent-Pipe
  • 3D API DirectX 10.1
  • Transport Package Original Package
  • Specification 1185*850*620mm
  • Trademark Immersion Cooling
  • Origin China
  • Product Name Immersion Cooling Oil Cooling 40kw
  • Power Consumption 40kw
  • Heat Rejection Water Loop
  • Power Distribution Dedicated Switchgear
  • Size(with Package) 1185*850*620mm
  • Weight 130kg
  • Max Temperature 65c/149f
  • Material Aluminum Alloy, Acrylic
  • Monitoring Temperature Sensor, APP, LED Board

Product Description

Apexto Oil Immersion Cooling Systems -Shorten ROI- Would you like an extra 40% to 50% profit? An immersion cooling system is a great way to get it. Not only does it shorten your ROI, it also provides other great benefits. Product Parameters 4 Advantages of immersion oil ...

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Transaction Info
Price US $ 1088/ Piece US $ 1,100.00-1,200.00/ Piece US $ 450.00-500.00/ Piece US $ 450.00-500.00/ Piece US $ 450.00-500.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T T/T T/T T/T
Quality Control
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Immersion Cooling Box;
Video Memory Capacity: 1024 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR3;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 256 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Silent-Pipe;
3D API: DirectX 10.1;
Product Name: Immersion Cooling Oil Cooling 40kw;
Power Consumption: 40kw;
Heat Rejection: Water Loop;
Power Distribution: Dedicated Switchgear;
Size(with Package): 1185*850*620mm;
Weight: 130kg;
Max Temperature: 65c/149f;
Material: Aluminum Alloy, Acrylic;
Monitoring: Temperature Sensor, APP, LED Board;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Geforce Rtx™ 3090;
Core Clock: 1785 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Supplier Name

Shenzhen Leaderspower Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier