Min. Order Reference FOB Price
1 Piece US$72,000.00-150,000.00 / Piece
Product Description
MD-S series automatic semiconductor wire ball bonder Speed: 21W/S for 2mm Welding line area: 56*80mm Leadframe width: 28-90mm Application: IC(SOP,SOT,DIP,BGA,COB.) LED(SMD,COB) Advantage: Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption The chip and ...