PCBA

US$1.18-1.34 / Piece

View

Multilayer 1-12oz Copper Thickness Fr4 PCB Board Assembly Manufacturer SMT DIP PCBA pictures & photos

Recommend for you
What is Mustar Professional Custom HDI Multilayer Medical Electronics PCB PCBA Design Service Assembly Manufacturer
What is Electronic GPS Tracker Copper Printed Circuit Board Manufacturer
What is Mustar Multilayer PCB & PCBA Manufacturer in Shenzhen

What is Multilayer 1-12oz Copper Thickness Fr4 PCB Board Assembly Manufacturer SMT DIP PCBA

Name: Multilayer 1-12oz Copper Thickness Fr4 PCB Board Assembly Manufacturer SMT DIP PCBA
Uploaded: 2023-12-28T11:41:42+08:00
Description: No.1 Custom-made Multilayer 1-12OZ Copper Thickness FR4 PCB Board Assembly Manufacturer SMT DIP PCBA In China Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Sol

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.18-1.34 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand Mustar
Transport Package ESD Bag, Bubble Pack
Specification standard
Trademark Mustar
Origin China
Certificate ISO9001/RoHS/ISO14001/ISO13485/Ts16949
Testing Service Aoi,X-ray,Function Test
Color Yellow Blue Green Black White
Service 24 Hours Technical Services

Product Description

No.1 Custom-made Multilayer 1-12OZ Copper Thickness FR4 PCB Board Assembly Manufacturer SMT DIP PCBA In China Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board ...

Learn More

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Number of Employees 35
Year of Establishment 2021-12-16
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

	Quick View Multilayer 1-12oz Copper Thickness Fr4 PCB Board Assembly Manufacturer SMT DIP PCBA Contact Now	Quick View High Tg Plate PCBA Bespoke Components for Smart Electronics Contact Now	Quick View Fr-4 PCBA Supplier Customize Multilayers Circuit Board PCBA Fabrication and Assembly Service Contact Now	Quick View Rigid-Flex PCB PCBA Manufacturing and PCB Assembly Services Contact Now	Quick View One Stop Electronics PCB Board Printed Circuit Board Contact Now

Transaction Info
	Quick View Multilayer 1-12oz Copper Thickness Fr4 PCB Board Assembly Manufacturer SMT DIP PCBA Contact Now	Quick View High Tg Plate PCBA Bespoke Components for Smart Electronics Contact Now	Quick View Fr-4 PCBA Supplier Customize Multilayers Circuit Board PCBA Fabrication and Assembly Service Contact Now	Quick View Rigid-Flex PCB PCBA Manufacturing and PCB Assembly Services Contact Now	Quick View One Stop Electronics PCB Board Printed Circuit Board Contact Now
Price	US $ 1.18-1.34/ Piece	US $ 0.76-5.00/ Piece	US $ 0.65-6.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.20-20.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	ISO9001/RoHS/ISO14001/ISO13485/Ts16949	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Mustar; Testing Service: Aoi,X-ray,Function Test; Color: Yellow Blue Green Black White; Service: 24 Hours Technical Services;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
Select All

Contact Now

Hot Search